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Discover the world of tungsten plates, an important class of materials known for their exceptional properties. Tungsten plates have a silver-white luster and perform well in high-temperature applications due to their strength and low coefficient of expansion. They have extremely high melting points and hardness, ensuring durability in harsh environments. Tungsten plates also have electrical conductivity and stable chemical properties, making them an important component in industries such as aerospace, electronics and manufacturing. These sheets have a high elastic modulus and low vapor pressure, playing a key role in applications where precision, stability and elasticity are critical.
Taizhou Huacheng Tungsten And Molybdenum Manufacture Co., Ltd.
Taizhou Huacheng Tungsten And Molybdenum Manufacture Co., Ltd.
Taizhou Huacheng Tungsten and Molybdenum Products Co., Ltd. is a professional company that produces tungsten and molybdenum series products. The company specializes in the production of tungsten and molybdenum special-shaped parts, high-density tungsten alloys, tungsten-copper alloys, and the research and development of new tungsten-molybdenum materials. Tungsten Plate Suppliers and Custom Tungsten Plate Factory. The main products are:
● Tungsten
● Molybdenum strip
● Plate
● Electrode rod
● Tungsten and molybdenum crucible
● Molybdenum Piercing Mandrel
● TZM rare earth molybdenum
● Sodium tungstate
● Sodium molybdate
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Industry knowledge
Are there specific alloy formulations or compositions of tungsten plate available for tailored applications?
There are specific alloy formulations or compositions of tungsten plate available to meet the requirements of various tailored applications. Tungsten alloys are often created by combining tungsten with other elements to achieve desired properties such as improved ductility, machinability, or enhanced performance in specific environments. Some common tungsten alloys used in plate form include:
Tungsten Heavy Alloys (W-Ni-Fe or W-Ni-Cu):
Composition: These alloys typically consist of tungsten combined with nickel and iron (W-Ni-Fe) or tungsten with nickel and copper (W-Ni-Cu).
Properties: Tungsten heavy alloys have high density and good mechanical properties. They are used in applications such as aerospace components, radiation shielding, and counterweights.
Copper-Tungsten Alloys (Cu-W):
Composition: Copper-tungsten alloys combine tungsten with copper, often in varying ratios.
Properties: These alloys exhibit a balance of high electrical and thermal conductivity from copper and the hardness and wear resistance of tungsten. They are used in electrical contacts, electrodes, and various aerospace and military applications.
Silver-Tungsten Alloys (Ag-W):
Composition: Silver-tungsten alloys combine tungsten with silver.
Properties: These alloys offer a balance of electrical conductivity from silver and the high melting point and durability of tungsten. They find applications in electrical contacts and switches.
Molybdenum-Tungsten Alloys (Mo-W):
Composition: Molybdenum-tungsten alloys combine tungsten with molybdenum.
Properties: These alloys may offer improved high-temperature stability and mechanical properties compared to pure tungsten. They are used in applications like high-temperature furnace components.
Lanthanum-Tungsten Alloys (La-W):
Composition: Lanthanum-tungsten alloys combine tungsten with lanthanum.
Properties: These alloys are known for their high-temperature strength and stability. They find applications in high-temperature environments, such as aerospace and defense.
Rare Earth-Tungsten Alloys:
Composition: Alloys incorporating rare earth elements with tungsten.
Properties: Rare earth-tungsten alloys may exhibit specific properties, such as improved high-temperature strength or enhanced corrosion resistance, depending on the exact composition. They can be used in various specialized applications.
Tantalum-Tungsten Alloys (Ta-W):
Composition: Tantalum-tungsten alloys combine tungsten with tantalum.
Properties: These alloys may provide enhanced corrosion resistance and high-temperature stability. They are used in applications where resistance to aggressive chemical environments is crucial.
Nickel-Tungsten Alloys (Ni-W):
Composition: Nickel-tungsten alloys combine tungsten with nickel.
Properties: These alloys can offer a balance of properties such as improved ductility and toughness compared to pure tungsten. They may be used in various industrial and electronic applications.
The choice of a specific tungsten alloy for a tailored application depends on the desired combination of properties required for that application. For example, if a balance of high density and mechanical strength is needed, tungsten heavy alloys may be chosen. 

Can Tungsten Plate be used as a target material for thin film deposition techniques?
Tungsten Plate can be used as a target material for thin film deposition techniques, specifically in a process known as physical vapor deposition (PVD). PVD methods, such as sputtering, are commonly employed for depositing thin films of various materials onto substrates. Tungsten is often chosen as a target material for its favorable properties, including high melting point, thermal stability, and compatibility with the sputtering process. Here are some key considerations:
Sputtering Process:
Physical Vapor Deposition (PVD): Sputtering is a PVD technique where ions from a plasma bombard a target material, dislodging atoms or molecules from the target surface. These dislodged particles then deposit as a thin film on a substrate placed in close proximity.
Advantages of Tungsten as a Target Material:
High Melting Point: Tungsten has a very high melting point (approximately 3,422°C or 6,192°F), making it suitable for high-temperature deposition processes.
Thermal Stability: Tungsten is thermally stable, ensuring that it remains in a solid state under the conditions of the sputtering process.
Semiconductor Industry: Tungsten thin films deposited by sputtering are widely used in the semiconductor industry. They may be employed for various purposes, including the creation of interconnects and metal layers in integrated circuits.
Tungsten Sputtering Targets:
Target Geometry: Tungsten targets for sputtering are typically available in various geometries, such as planar or rotary targets, depending on the specific requirements of the deposition system.
Purity Levels: High-purity tungsten targets are often preferred to minimize impurities in the deposited films, ensuring the desired properties of the thin film.
Film Characteristics:
Adhesion and Uniformity: Tungsten thin films deposited using tungsten sputtering targets exhibit good adhesion to substrates and uniform thickness across the coated surface.
Film Structure: The sputtering process allows for control over the microstructure and properties of the deposited tungsten film.
Compatibility with Different Substrates:
Substrate Materials: Tungsten thin films can be deposited onto various substrate materials, including silicon wafers, glass, and other materials commonly used in the electronics industry.
Deposition Systems:
Magnetron Sputtering: Magnetron sputtering is a commonly used technique for depositing tungsten thin films. It involves the use of magnetic fields to enhance the efficiency of the sputtering process.
Specific Applications:
Barrier Layers: Tungsten thin films are often used as barrier layers in semiconductor devices to prevent the diffusion of materials between different layers.
Interconnects: Tungsten is used as a material for metal interconnects in advanced semiconductor technology nodes.
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